CURRENT Sensor RESISTOR HEAT SINKS for CIRCUIT BOARD COMPONENTS
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An electronics customer contracted OMNI Engineering, Inc. to manufacture these current sensor resistor heat sinks to be used across various product specifications. The miniature precision stampings are produced on 30 ton Bruderer presses, which are capable of meeting tolerances of +/-0.0005” throughout 20,000 to 80 million heat sinks we produce annually. Stamped from C102 copper and C110 half-hard copper. After stamping the heat sinks are deburred, and plated with matte sulfamate nickel and tin plating. Additional components use inlaid and/or clad materials in tin and/or silver.
Production is monitored through real time SPC data collection and reporting, Quality is maintained through dimensional and visual inspections. All parts meet MIL-STD-202 standards for solderability, with orders being manufactured with 2 to 4 week lead times.
To learn more about this project, see the table below or contact us directly.
Custom Current Sensor Resistor Heat Sinks for Circuit Board Components
|Custom Stamping Product Description
||Heat sinks used in circuit board components
|Miniature / Micro Miniature Capabilities Applied / Processes
Miniature / Micro Miniature Stampings
Matte Sulfamate Nickel Plating
Matte Tin Plating
Inlayed (overlaid) Materials - Tin / Silver
|Equipment used to Manufacture Part
||22 & 30 Ton Bruderer Presses
Carbide Progressive Dies
|Overall Part Dimensions
||Thickness: 0.0254" - 0.032"
Width: 0.044" to 0.250"
Length: 0.140" to 0.375"
Angular: ± ½°
||C102 Copper Alloy
C110 Beryllium Copper Alloy
|In process testing / Inspection performe
Real-time SPC Data Collection / Reporting
|Industry for Use
||20,000 - 50,000,000 annually
|Delivery / Turnaround Time
||2 - 4 Weeks
2D CAD Drawings
RoHS - REACH Compliant
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