CUSTOM PROGRESSIVE DIES PRECISION METAL STAMPING SERVICESEXAMPLES OF OUR
WORK
Custom Contact Springs for Trimming Potentiometers in The Electronics and Medical IndustriesCustom Stampings of Contacts for The Electrical IndustryCustom Leadframes for The Electronics IndustryCustom Stamped Clips for The Aerospace IndustryCustom Current Sensor Resistor Heat Sinks for Circuit Board ComponentsStampings and Assemblies of Components for The Medical Industry
OMNI Engineering, Inc. requires our suppliers of raw materials and plating processes utilized in our manufacturing, to comply with the Dodd-Frank Wall Street Reform Consumer Protection Act (Conflict Materials Act).
ISO 9001 9001 Bureau Veritas CertificationISO 9001: 2015
ISO 9001 ANAB Certificate FinalISO 9001 UKAS Certificate Final
ISO 9001 INMETRO Certificate Final

CUSTOM LEADFRAMES FOR THE ELECTRONICS INDUSTRY

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OMNI Engineering, Inc. was contracted to produce a series of stamped leadframes for use in various circuit boards due to our reputation for providing precision miniature and micro miniature stampings.

Manufacturing of these intricate parts is performed with carbide progressive dies in high speed 30 ton Bruderer presses, which are capable of holding tolerances of +/-0.0005”. The customer identified the pilot hole diameter, progression and camber as critical to their automated assembly operation. This we were able to hold in addition to dimensional tolerances of +/-0.0005”. Stamped leadframes are then plated with tin, palladium nickel, or gold, quality control is maintained through the use of our F.O.V. Smartscope (automated inspection system), dimensional, camber, and visual inspections. In addition to our own stringent quality standards, this project also requires compliance to Mil-Std-202 and ASTM B571 standards. We currently manufacture 50,000 to 500 million of these components annually.

To learn more about this project, or the processes used to manufacture it, see the table below or contact us directly.

Custom Leadframes for The Electronics Industry
Custom Leadframes for The Electronics Industry

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Custom Stamping Product Description Leadframes used in circuit board components
Miniature / Micro Miniature Capabilities Applied / Processes Primary:
Miniature / Micro Miniature Stampings
Precision Stampings

Secondary:
Tin Plating
Gold Plating
Palladium Nickel Plating
Equipment used to Manufacture Part 22 & 30 Ton Bruderer Presses
Carbide Progressive Dies
Overall Part Dimensions Thickness: 0.0050" - 0.010"
Width: 0.0793" to 0.850"
Length: 0.450" to 2.806"
Tolerances Dimensional: +/-0.0005"
Angular: +/- ½°
Material Used CA110 Beryllium Copper Alloy
CA260 Cartridge Brass
CA725 Nickel Silver
CA521 Phosphor Bronze
CA19410 Copper Alloy
In process testing / Inspection performed
F.O.V. Smartscope (automated Inspection system)
Dimensional Inspection
Camber Inspection
Visual Inspection
Real-time SPC Data Collection / Reporting
Industry for Use Electronics
Volume 50,000 - 500,000,000 annually
Delivery/Turnaround Time 2 - 4 Weeks
Delivery Location Mexico
Central America
Asia
Standards Met Customer Specifications
2D CAD Drawings
MIL-STD-202
ASTM B-571
RoHS - REACH Compliant
Product Name Leadframes

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Omni Engineering, Inc. | Progressive Dies | Stampings