An electronics customer contracted OMNI Engineering, Inc. to manufacture these current sensor resistor heat sinks to be used across various product specifications. The miniature precision stampings are produced on 30 ton Bruderer presses, which are capable of meeting tolerances of +/-0.0005” throughout 20,000 to 80 million heat sinks we produce annually. Stamped from C102 copper and C110 half-hard copper. After stamping the heat sinks are deburred, and plated with matte sulfamate nickel and tin plating. Additional components use inlaid and/or clad materials in tin and/or silver.

Production is monitored through real time SPC data collection and reporting, Quality is maintained through dimensional and visual inspections. All parts meet MIL-STD-202 standards for solderability, with orders being manufactured with 2 to 4 week lead times.

To learn more about this project, see the table below or contact us directly.

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Custom Stamping Product Description

Heat sinks used in circuit board components

Miniature / Micro Miniature Capabilities Applied / Processes

Primary:
Miniature / Micro Miniature Stampings
Precision Stampings

Secondary:
De-Burring
Matte Sulfamate Nickel Plating
Matte Tin Plating
Inlayed (overlaid) Materials – Tin / Silve

Equipment used to Manufacture Part

22 & 30 Ton Bruderer Presses
Carbide Progressive Dies

Overall Part Dimensions

Thickness: 0.0254″ – 0.032″
Width: 0.044″ to 0.250″
Length: 0.140″ to 0.375″

Tolerances

+/-0.0005″
Angular: ± ½°

Material Used

C102 Copper Alloy
C110 Beryllium Copper Alloy

In process testing / Inspection performe

Dimensional Inspection
Gage Inspection
Visual Inspection
Real-time SPC Data Collection / Reporting

Industry for Use

Electronics

Volume

20,000 – 50,000,000 annually

Delivery / Turnaround Time

2 – 4 Weeks

Delivery Location

United States

Standards Met

Customer Specifications
2D CAD Drawings
MIL-STD-202
RoHS – REACH Compliant

Product Name

Heat Sinks